As a printed circuit board (PCB) manufacturer, choosing the right materials is crucial to ensure optimal performance and reliability of electronic products. TUC TU-872 SLK PCB materials are designed to meet the demanding requirements of modern electronic applications. With its exceptional properties and versatility, TU-872 SLK offers a reliable solution for various industries. In this article, we will explore the key benefits and features of TU-872 SLK from the perspective of PCB manufacturers.
Definition of TUC TU-872 SLK
TU-872 SLK is a cutting-edge circuit board material engineered for high-performance applications. It is crafted using a modified epoxy FR-4 resin renowned for its exceptional properties. The material is reinforced with regular woven E-glass, resulting in a robust structure that offers low dielectric constant and low dissipation factor. These features make TU-872 SLK ideal for high-speed, low-loss, and high-frequency multilayer circuit board applications.
One of the key advantages of TU-872 SLK is its compatibility with both environmental protection lead-free processes and traditional FR-4 processes. This versatility allows manufacturers to seamlessly incorporate TU-872 SLK into their existing production workflows, ensuring a smooth transition and enhanced flexibility.
Furthermore, TU-872 SLK laminates exhibit remarkable resistance to moisture, making them highly reliable in humid environments. The material also boasts improved coefficient of thermal expansion (CTE), ensuring dimensional stability under varying temperature conditions. Its superior chemical resistance safeguards against potential damage caused by exposure to harsh chemicals, while its exceptional thermal stability helps maintain optimal performance even in demanding thermal environments.
In addition, TU-872 SLK laminates demonstrate an impressive resistance to Conductive Anodic Filamentation (CAF), which is a common issue in electronic applications. This resistance enhances the longevity and reliability of circuit boards utilizing TU-872 SLK.
Moreover, the material’s toughness is significantly enhanced by the inclusion of an allyl network forming compound. This reinforcement ensures that TU-872 SLK laminates can withstand mechanical stress and maintain structural integrity, even in demanding operating conditions.
Overall, TU-872 SLK stands as a superior choice for circuit board manufacturing, offering a comprehensive range of benefits, including high performance, compatibility with various manufacturing processes, excellent moisture resistance, improved CTE, superior chemical resistance, thermal stability, CAF resistance, and enhanced toughness.
Standard Availability of TUC TU-872 SLK PCB Substrates Materials
TUC TU-872 SLK PCB substrate materials are offered with standard availability options to meet various manufacturing requirements. Here are the standard availability specifications:
1.Thickness:
TU-872 SLK is available in a range of thicknesses from 0.002″ [0.05mm] to 0.062″ [1.58mm]. This allows manufacturers to select the appropriate thickness based on their specific application needs. The material is available in both sheet and panel forms, providing flexibility in production processes.
2.Copper Foil Cladding:
The copper foil cladding options for TU-872 SLK include a range from 1/3 oz to 5 oz for built-up and double-sided applications. This selection enables manufacturers to customize the copper weight based on their circuit design and performance requirements.
3.Prepregs:
Prepregs, which are resin-impregnated fiberglass sheets, are available for TU-872 SLK in both roll and panel forms. This availability ensures compatibility with different manufacturing setups and facilitates efficient production processes.
4.Glass Styles:
TU-872 SLK offers a range of glass styles to accommodate specific design and performance needs. The available glass styles include 106, 1080, 3313, 2116, and other prepreg grades upon request. These different glass styles provide flexibility in tailoring the material’s properties to meet the desired performance specifications.
Overall, TUC TU-872 SLK PCB substrate materials are available in various thicknesses, with options for copper foil cladding and prepregs in different forms. The availability of different glass styles further allows customization based on specific application requirements.
Performance and Features of TUC TU-872 SLK
TUC TU-872 SLK PCB materials offer a host of performance and processing advantages that make them an exceptional choice for circuit board manufacturing. Here are some of the key benefits:
1. Excellent Electrical Properties: TU-872 SLK exhibits excellent electrical properties, ensuring reliable signal transmission and minimizing signal loss.
2. Low Dielectric Constant: With a dielectric constant of less than 4.0, TU-872 SLK enables efficient signal propagation and reduces transmission line losses, making it suitable for high-frequency applications.
3. Low Dissipation Factor: The material boasts a dissipation factor of less than 0.010, indicating minimal energy loss during signal transmission. This low dissipation factor contributes to improved signal integrity and reduced attenuation.
4. Stable and Flat Dk/Df Performance: TU-872 SLK maintains a stable and consistent dielectric constant and dissipation factor across a range of frequencies. This characteristic ensures predictable and reliable performance in high-speed and high-frequency applications.
5. Compatibility with Modified FR-4 Processes: TU-872 SLK is designed to be compatible with modified FR-4 processes. This compatibility allows for seamless integration into existing manufacturing workflows, providing enhanced flexibility and ease of adoption.
6. Excellent Moisture Resistance and Lead-Free Reflow Process Compatibility: The material exhibits excellent moisture resistance, safeguarding against potential damage caused by humidity. Additionally, TU-872 SLK is suitable for lead-free reflow processes, aligning with environmental regulations and industry trends.
7. Improved Z-Axis Thermal Expansion: TU-872 SLK offers improved Z-axis thermal expansion, ensuring dimensional stability and reducing the risk of delamination or warping due to temperature variations. This thermal stability is crucial for reliable performance in diverse operating conditions.
8. Anti-CAF Capability: TU-872 SLK demonstrates superior resistance to Conductive Anodic Filamentation (CAF), a common concern in electronic applications. This resistance enhances the longevity and reliability of circuit boards, particularly in harsh operating environments.
9. Superior Dimensional Stability, Thickness Uniformity, and Flatness: The material exhibits exceptional dimensional stability, ensuring consistent performance and reliable assembly. It also maintains excellent thickness uniformity and flatness, facilitating precise manufacturing processes and reliable interconnection.
10. Excellent Through-Hole and Soldering Reliability: TU-872 SLK provides excellent through-hole reliability, ensuring robust interconnectivity and long-term durability. The material also offers exceptional soldering reliability, promoting strong and reliable solder joints.
Industry Approvals of TU-872 SLK PCB Materials
TU-872 SLK PCB materials have received industry approvals and certifications that validate their quality and compliance with industry standards. Here are the industry approvals for TU-872 SLK:
1. IPC-4101E Type Designation: TU-872 SLK is designated under IPC-4101E with the following type designations: /29, /99, /101, and /126. These designations indicate the specific material properties and characteristics of TU-872 SLK, ensuring its compatibility and adherence to industry standards.
2. IPC-4101E/126 Validation Services QPL Certified: TU-872 SLK has undergone IPC-4101E/126 validation services and is certified under the Qualified Products List (QPL). This certification verifies that TU-872 SLK meets the stringent requirements and performance standards outlined by IPC-4101E/126, ensuring its reliability and quality.
3. UL Designation – ANSI Grade: FR-4.0: TU-872 SLK carries a UL designation of ANSI Grade FR-4.0. This designation confirms that the material meets the rigorous standards set by Underwriters Laboratories (UL) for flame retardancy and electrical performance. It signifies the high-quality and safety of TU-872 SLK for use in electronic applications.
4. UL File Number: E189572: TU-872 SLK is associated with UL File Number E189572. This UL file number serves as a reference and traceability for the material, indicating that it has undergone UL testing and evaluation for compliance with safety and performance requirements.
5. Flammability Rating: 94V-0: TU-872 SLK has achieved a flammability rating of 94V-0. This rating, in accordance with UL standards, demonstrates the material’s excellent fire-resistant properties, indicating its ability to self-extinguish and minimize the spread of flames in case of a fire.
6. Maximum Operating Temperature: TU-872 SLK is designed to withstand a maximum operating temperature of 130°C. This temperature rating ensures that the material can perform reliably under elevated temperature conditions, maintaining its electrical and mechanical properties.
Applications of TUC TU-872 SLK
TUC TU-872 SLK finds a wide range of applications across various industries due to its exceptional properties and performance. Here are some of the key applications of TU-872 SLK:
1. Radio Frequency: TU-872 SLK is well-suited for radio frequency (RF) applications. Its low dielectric constant and low dissipation factor contribute to efficient signal transmission and minimal signal loss, making it ideal for RF circuitry in wireless communication systems.
2. Backpanel and High-Performance Computing: TU-872 SLK is commonly utilized in backpanel applications, providing reliable interconnectivity and high-speed data transmission in advanced computing systems. Its high-performance characteristics and compatibility with high-speed signals make it suitable for demanding computing applications.
3. Line Cards and Storage: TU-872 SLK is employed in line cards and storage systems, where high-speed data transfer and signal integrity are critical. The material’s low loss and high-frequency capabilities ensure reliable performance in these applications, supporting efficient data processing and storage.
4. Servers, Telecom, and Base Stations: TU-872 SLK is widely used in server systems, telecommunication equipment, and base stations. Its excellent electrical properties, moisture resistance, thermal stability, and dimensional stability make it an ideal choice for these applications, ensuring reliable and continuous operation in demanding environments.
5. Office Routers: TU-872 SLK is also applied in office routers, where high-speed data transmission, signal integrity, and reliability are essential. The material’s low dielectric constant, low dissipation factor, and compatibility with high-frequency signals contribute to efficient data routing and reliable performance in office network systems.
Overall, TUC TU-872 SLK has extensive applications in radio frequency, backpanel and high-performance computing, line cards and storage, servers, telecom, base stations, and office routers. Its exceptional electrical properties, stability, and compatibility with high-speed signals make it a preferred choice for these demanding electronic applications.
TUC TU-872 SLK Compare with High frequency PCB Materials
When comparing TUC TU-872 SLK with high-frequency PCB materials, there are several factors to consider. Here’s a comparison between TU-872 SLK and typical high-frequency PCB materials:
1.Dielectric Constant (Dk):
TU-872 SLK has a dielectric constant of less than 4.0, which is relatively low compared to some high-frequency materials. High-frequency PCB materials are specifically designed to have very low Dk values, typically ranging from 2 to 3.5. This low Dk allows for better signal propagation and reduced signal loss at high frequencies.
2.Dissipation Factor (Df):
TU-872 SLK has a dissipation factor of less than 0.010, indicating low energy loss during signal transmission. High-frequency materials are engineered to have extremely low Df values, often below 0.001, ensuring minimal signal attenuation and improved signal integrity.
3.Frequency Performance:
High-frequency PCB materials are specifically designed to excel at high-frequency applications, typically in the GHz range. They offer excellent signal performance, minimal signal loss, and low signal distortion, making them suitable for demanding high-frequency circuits. While TU-872 SLK offers good electrical properties, it may not provide the same level of performance in very high-frequency applications as dedicated high-frequency materials.
4.Moisture Resistance:
TU-872 SLK exhibits excellent moisture resistance, which is crucial for the reliability of PCBs. Similarly, high-frequency materials are designed to have good moisture resistance to prevent performance degradation and electrical failures in humid environments.
5.Thermal Stability:
Both TU-872 SLK and high-frequency materials are engineered to have good thermal stability. They offer low thermal expansion coefficients to minimize the risk of delamination or warping due to temperature variations. This is important for maintaining the dimensional stability and reliability of the PCB.
6.Availability and Cost:
High-frequency PCB materials are often specialized and may have limited availability compared to standard materials like TU-872 SLK. Additionally, high-frequency materials can be more expensive due to their specific formulation and performance characteristics.
In Conclusion
TUC TU-872 SLK PCB materials offer PCB manufacturers a reliable and high-performance solution for their electronic applications. With its low Dk and Df values, excellent reliability, versatility, and compatibility with industry standards, TU-872 SLK empowers manufacturers to design and produce PCBs that meet the stringent requirements of today’s electronic devices. By choosing TU-872 SLK, manufacturers can enhance the performance, reliability, and durability of their PCBs, ultimately delivering superior electronic products to their customers.
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