In the dynamic landscape of PCB manufacturing, the choice of materials plays a pivotal role in defining the success of electronic designs. TUC TU-872 LK PCB materials emerge as a beacon of excellence, offering a spectrum of attributes that elevate the performance and reliability of printed circuit boards.
Engineered on a foundation of high-performance modified epoxy FR-4 resin, TU-872 LK stands out with its compatibility with low-loss, high-frequency applications. The material’s low dielectric constant and dissipation factor, coupled with environmental compliance and anti-CAF capability, make it a compelling choice for discerning circuit board manufacturers.
TUC TU-872 LK
TU-872 LK is formulated on the foundation of a high-performance modified epoxy FR-4 resin. This advanced material incorporates a reinforcement of standard woven E-glass and is meticulously engineered to feature a low dielectric constant and minimal dissipation factor. Its design is specifically tailored to cater to the demands of high-speed, low-loss, and high-frequency multilayer circuit board applications.
The TU-872 LK material stands out for its compatibility with environmentally friendly, lead-free processes, and seamlessly integrates with FR-4 processes. Noteworthy characteristics of TU-872 LK laminates include exceptional Coefficient of Thermal Expansion (CTE), superior chemical resistance, thermal stability, resistance to Conductive Anodic Filamentation (CAF), and augmented toughness achieved through the incorporation of an allyl network-forming compound.
Performance and Processing Advantages
TUC TU-872 LK PCB materials offer a myriad of performance and processing advantages, making them a preferred choice in demanding electronic applications:
Excellent Electrical Properties: TU-872 LK exhibits outstanding electrical properties, ensuring reliable and efficient signal transmission within the PCB.
Low Dielectric Constant: With a dielectric constant of less than 4.0, TU-872 LK contributes to minimizing signal loss and distortion, particularly in high-frequency applications.
Low Dissipation Factor: The material features a dissipation factor of less than 0.010, indicating minimal energy loss during signal transmission and enhancing overall signal integrity.
Stable and Flat Dk/Df Performance: TU-872 LK maintains a stable and flat performance in terms of both dielectric constant (Dk) and dissipation factor (Df), ensuring consistent electrical characteristics across the PCB.
Compatibility with Most FR-4 Processes: The material seamlessly integrates with a wide range of FR-4 processes, providing flexibility and ease of manufacturing.
Lead-Free Process Compatibility: TU-872 LK is designed to be compatible with lead-free processes, aligning with environmental standards and regulations.
Improved Z-Axis Thermal Expansion: The material exhibits enhanced thermal expansion in the Z-axis, contributing to improved overall thermal stability in PCB applications.
Anti-CAF Capability: TU-872 LK demonstrates resistance to Conductive Anodic Filamentation (CAF), ensuring the longevity and reliability of the PCB in challenging conditions.
Superior Dimensional Stability, Thickness Uniformity, and Flatness: The material excels in maintaining superior dimensional stability, thickness uniformity, and flatness, critical factors in the precision and reliability of PCB manufacturing.
Excellent Through-Hole and Soldering Reliability: TU-872 LK ensures excellent reliability in through-hole structures and soldering processes, contributing to the overall durability and performance of the PCB.
Disadvantages of TUC TU-872
While TUC TU-872 LK PCB substrate materials offer numerous advantages, it’s important to consider potential disadvantages to make informed decisions in specific applications. Some potential drawbacks include:
Cost: High-performance materials often come with a higher price tag. The enhanced characteristics of TU-872 LK may lead to a higher overall cost for PCB manufacturing compared to more standard materials.
Specialized Processing Requirements: The advanced properties of TU-872 LK may require specialized processing equipment or techniques, which could impact the ease of manufacturing and potentially increase production costs.
Limited Availability: Depending on the region or supplier, TU-872 LK may not be as readily available as more common PCB substrate materials. Limited availability could lead to challenges in sourcing the material.
Learning Curve: Shifting to a new and advanced material may require additional training for PCB manufacturers and designers to fully leverage its capabilities. This learning curve could initially slow down the adoption process.c
Application Specificity: While TU-872 LK excels in high-speed, low-loss, and high-frequency applications, it might not be the optimal choice for all PCB applications. It’s important to carefully assess whether the material’s properties align with the specific requirements of a given project.
Environmental Sensitivity: While TU-872 LK is compatible with lead-free processes, its environmental sensitivity may still pose challenges in certain applications or industries with stringent environmental regulations.
It’s crucial to conduct a thorough analysis of the specific requirements of a PCB project and weigh the advantages against these potential disadvantages. In many cases, the superior performance characteristics of TU-872 LK may outweigh these drawbacks, especially in applications where high performance and reliability are paramount.
Standard Availability of TUC TU-872
TUC TU-872 LK PCB materials are readily available in a range of standard specifications, providing flexibility for various application requirements:
Thickness:
●Available thickness ranges from 0.002” [0.05mm] to 0.062” [1.58mm].
●Offered in both sheet and panel forms, accommodating diverse manufacturing preferences.
Copper Foil Cladding:
●Copper foil cladding options ranging from 1/3 to 5 oz are available for both built-up and double-sided configurations.
●This broad range of copper foil options caters to different conductivity and layering requirements in PCB design.
Prepregs:
●Prepregs are conveniently provided in either roll or panel form, offering flexibility in the manufacturing process.
●This adaptability ensures ease of integration into various production setups.
Glass Styles:
●Various glass styles are available, including but not limited to 106, 1080, 3313, 2116.
●Additional prepreg grades can be made available upon request, allowing for customization to specific project needs.
The comprehensive availability of TU-872 LK in different thicknesses, copper foil cladding options, prepreg forms, and glass styles reflects the commitment to providing versatile solutions that can be tailored to meet the unique specifications and preferences of PCB manufacturers and designers.
Industry Approvals of TUC TU-872 LK PCB Substrates Materials
TUC TU-872 LK PCB substrate materials boast a range of industry approvals, underscoring their compliance with established standards and specifications:
IPC-4101E Type Designation:
The material conforms to IPC-4101E standards and holds the Type Designations of /29, /99, /101, and /126. These designations signify the material’s compatibility with specific industry requirements.
IPC-4101E/126 Validation Services QPL Certified:
TU-872 LK has undergone IPC-4101E/126 Validation Services and is Quality Product List (QPL) certified. This certification attests to its adherence to rigorous industry standards and specifications.
UL Designation – ANSI Grade:
The material is designated with the Underwriters Laboratories (UL) ANSI Grade of FR-4.0. This classification indicates its compliance with UL standards, specifically for flame resistance and electrical performance.
UL File Number:
TU-872 LK is assigned the UL File Number E189572, providing a reference for its UL certification. This number serves as a traceable identifier for regulatory and compliance purposes.
Flammability Rating:
The material holds a flammability rating of 94V-0, indicating excellent flame resistance. This is a crucial characteristic for ensuring the safety and reliability of electronic components in various applications.
Maximum Operating Temperature:
TU-872 LK is designed to operate at a maximum temperature of 130°C. This information is vital for applications requiring materials with high-temperature stability.
The industry approvals and certifications of TU-872 LK reinforce its reliability and suitability for use in electronic components and circuitry, meeting the stringent requirements of standards organizations and regulatory bodies.
What Factor Consider when choose Tu-872 LK in Your PCB Design?
When considering TUC TU-872 LK for your PCB design, several factors should be taken into account to ensure that the material aligns with the specific requirements of your project. Here are key factors to consider:
High-Frequency Applications:
TU-872 LK is designed for high-speed and high-frequency applications. If your PCB design involves signals operating in the high-frequency range, this material’s low dielectric constant and low dissipation factor make it a suitable choice.
Signal Integrity Requirements:
If your design demands stringent signal integrity, TU-872 LK’s stable and flat Dk/Df performance can contribute to maintaining consistent electrical characteristics, minimizing signal loss, and reducing distortion.
Environmental Considerations:
If your project requires compliance with lead-free processes or specific environmental regulations, TU-872 LK’s compatibility with lead-free processes and environmental certifications may be a decisive factor.
Thermal Stability Requirements:
If your application involves elevated temperatures, the improved z-axis thermal expansion of TU-872 LK can contribute to enhanced thermal stability, ensuring reliable performance even in challenging thermal conditions.
Resistance to CAF:
If your PCB design needs to withstand challenging conditions where Conductive Anodic Filamentation (CAF) could be a concern, TU-872 LK’s anti-CAF capability can be an important consideration.
Dimensional Stability and Uniformity:
For applications where dimensional stability, thickness uniformity, and flatness are critical, TU-872 LK’s superior dimensional stability characteristics can contribute to the overall reliability of the PCB.
Flame Resistance:
If your design requires materials with high flame resistance, TU-872 LK’s 94V-0 flammability rating indicates excellent resistance to combustion.
Availability and Cost:
Assess the availability of TU-872 LK from suppliers in your region. Additionally, consider the material cost in relation to your budget constraints, keeping in mind the potential performance advantages it offers.
Application-Specific Requirements:
Consider the specific requirements of your application. TU-872 LK is particularly well-suited for backpanels, high-performance computing, line cards, storage systems, servers, telecom, base stations, and office routers. Ensure that your application aligns with the material’s strengths.
By carefully evaluating these factors in the context of your PCB design requirements, you can make an informed decision on whether TUC TU-872 LK is the optimal choice for your specific application.
Applications of TUC TU-872 LK PCB Materials
TUC TU-872 LK finds versatile applications in the field of printed circuit boards (PCBs), particularly excelling in the following areas:
Backpanel and High-Performance Computing: TU-872 LK is well-suited for backpanel applications, providing reliability and performance crucial in high-performance computing environments.
Line Cards and Storage Systems: The material is aptly utilized in the manufacturing of line cards and storage systems, offering the required characteristics for efficient data transmission and storage functionalities.
Servers: TU-872 LK demonstrates its efficacy in server applications, contributing to the overall performance and reliability of server systems.
Telecom and Base Stations: Its attributes make TU-872 LK suitable for deployment in telecom infrastructure and base stations, ensuring dependable and high-speed communication.
Office Routers: The material is employed in the fabrication of office routers, where its properties contribute to the stability and efficiency of data routing within office networks.
The unique combination of TU-872 LK’s low dielectric constant, low dissipation factor, environmental compatibility with lead-free processes, and compatibility with FR-4 processes makes it an optimal choice for demanding applications in the realm of electronic devices and communication systems.
Conclusion
As we navigate the intricate realms of PCB design and manufacturing, TUC TU-872 LK asserts itself as a material of choice for those seeking a harmonious blend of performance, reliability, and environmental responsibility. From its excellent electrical properties to its stability in high-frequency applications, TU-872 LK exemplifies a commitment to quality and innovation in the ever-evolving landscape of circuit board materials.
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