In the world of circuit board engineering, selecting the right materials is crucial for designing reliable and high-performance PCBs. Shengyi S7045G, a high TG (glass transition temperature) PCB material, offers a range of advantages that make it a preferred choice for many engineers. With its exceptional thermal stability, excellent electrical performance, and compatibility with modern manufacturing processes, Shengyi S7045G is a reliable solution for various applications demanding high-quality PCBs.
Overview of Shengyi S7045G High TG PCB Materials
Shengyi S7045G is a type of high-temperature, high-Tg (glass transition temperature) printed circuit board (PCB) material manufactured by the Shengyi Technology Co., Ltd. It is designed to meet the demanding requirements of various electronic applications that involve high thermal stress and reliability.
Here are the features of Shengyi S7045G PCB Materials:
1.Lead-free Compatible:
Shengyi S7045G is compatible with lead-free soldering processes, ensuring compliance with environmental regulations and the use of safer soldering materials.
2.High Tg Halogen-Free:
The material has a high glass transition temperature (Tg) of 180˚C (DMA), which indicates its ability to withstand high temperatures without compromising its mechanical and electrical properties. It offers enhanced thermal stability and reliability.
3.UV Blocking/AOI Compatible:
Shengyi S7045G is designed to block ultraviolet (UV) light and is compatible with Automated Optical Inspection (AOI) systems. This feature allows for accurate inspection and detection of potential defects during the manufacturing process.
4.Lower Z-Axis CTE:
The material exhibits a lower coefficient of thermal expansion (CTE) in the Z-axis direction, minimizing the risk of delamination and stress-induced failures. This characteristic contributes to improved reliability and durability of the PCB.
5.Anti-CAF Capability:
Shengyi S7045G possesses anti-CAF (Conductive Anodic Filament) capability. CAF is a phenomenon where conductive filaments form in the presence of moisture and bias voltage, causing electrical shorts. The material’s anti-CAF property helps mitigate this issue, ensuring long-term performance and reliability.
6.Excellent Through-Hole Reliability:
Shengyi S7045G PCB material is known for its excellent through-hole reliability. It offers strong adhesion and reliability for plated-through-hole (PTH) structures, reducing the risk of open circuits or solder joint failures.
7.Low Insertion Loss, Dk/Df @ 1GHz:
Shengyi S7045G exhibits low insertion loss, which means it minimizes signal loss or attenuation when transmitting high-frequency signals. The material has a dielectric constant (Dk) of 4.3 and a low dissipation factor (Df) of 0.010 at 1GHz, indicating good signal integrity and transmission performance.
These features collectively make Shengyi S7045G PCB materials suitable for a wide range of applications, including high-speed digital circuits, telecommunications, automotive electronics, aerospace, and other industries where high thermal stability, reliability, and excellent electrical performance are crucial.
Characteristics of Shengyi S7045G PCB Material
1. High Glass Transition Temperature (Tg): Shengyi S7045G is known for its high Tg, which refers to the temperature at which the material undergoes a transition from a glassy state to a rubbery state. It offers a Tg value of typically 180-190°C, indicating excellent dimensional stability and resistance to high temperatures.
2. Thermal Stability: The high Tg of S7045G allows it to withstand elevated temperatures without significant changes in its mechanical and electrical properties. This makes it suitable for applications that involve high-power components, high ambient temperatures, or processes with elevated thermal profiles.
3. Low Coefficient of Thermal Expansion (CTE): Shengyi S7045G exhibits a low CTE, which means it has minimal dimensional changes in response to temperature variations. This characteristic helps to reduce the risk of delamination, solder joint failure, and other thermal stress-related issues.
4. Excellent Electrical Performance: S7045G provides good electrical properties, including low dielectric loss tangent and low moisture absorption. This makes it suitable for high-frequency and high-speed applications where signal integrity and transmission performance are crucial.
5. Good Chemical Resistance: The material offers good resistance to various chemicals, including acids, bases, and solvents. This property enhances its reliability and makes it suitable for applications exposed to harsh environments or chemical processes.
6. Process Compatibility: Shengyi S7045G is compatible with standard PCB fabrication processes, such as drilling, plating, soldering, and surface finishing. It can be used for both single-layer and multilayer PCBs, offering flexibility in design and manufacturing.
7. RoHS Compliant: S7045G is compliant with the Restriction of Hazardous Substances (RoHS) directive, which restricts the use of certain hazardous materials in electronic products. This ensures its environmental friendliness and compliance with global regulations.
It’s important to note that specific technical data, such as the exact Tg range, CTE values, and other detailed specifications, may vary depending on the specific grade or variant of Shengyi S7045G PCB material.
Comparison with Other PCB Materials
When comparing Shengyi S7045G PCB material with other PCB materials, it’s important to consider factors such as thermal performance, electrical properties, mechanical strength, and specific application requirements. Here’s a general comparison with some commonly used PCB materials:
1. FR-4: FR-4 is a widely used standard PCB material. Compared to FR-4, Shengyi S7045G offers a higher glass transition temperature (Tg) of typically 180-190°C, indicating superior thermal stability. It also has a lower coefficient of thermal expansion (CTE) in the Z-axis, reducing the risk of delamination. Shengyi S7045G may have better electrical performance, such as lower dielectric loss tangent and lower insertion loss at high frequencies.
2. High-Speed Materials (e.g., Rogers, Isola): High-speed materials are designed for applications with stringent signal integrity requirements. They often have lower dielectric constant (Dk) and lower loss tangent (Df) compared to standard materials like FR-4. Shengyi S7045G may have a higher Dk and Df compared to specialized high-speed materials, but it still offers good electrical performance for many high-speed applications.
3. Metal Core PCBs (MCPCB): MCPCBs are used for applications that require efficient heat dissipation. While Shengyi S7045G offers a high Tg and good thermal stability, MCPCBs with metal cores provide even better heat dissipation due to the presence of a thermally conductive metal layer.
4. Ceramic PCBs: Ceramic PCBs are known for their excellent thermal conductivity and high-frequency performance. They are often used in applications involving high-power components and high-frequency circuits. Shengyi S7045G may not match the thermal conductivity of ceramic PCBs but offers a good balance of thermal stability, electrical performance, and cost-effectiveness.
It’s important to note that the specific properties and performance characteristics of PCB materials can vary depending on the manufacturer, grade, and specific product specifications. Therefore, it’s recommended to consult manufacturers’ datasheets and conduct thorough evaluations to determine the most suitable PCB material for your specific application requirements.
Key Factor for Choosing Shengyi S7045G
When using Shengyi S7045G high TG PCB materials in PCB design and manufacturing, several factors should be considered:
1. Thermal Performance: Shengyi S7045G is known for its high glass transition temperature (Tg), which makes it suitable for applications with high operating temperatures. Consider the thermal performance requirements of the end product and ensure that the material can withstand the expected temperature range.
2. Mechanical Strength: Evaluate the mechanical properties of Shengyi S7045G, such as its tensile strength, flexural strength, and impact resistance. These properties are crucial for ensuring the reliability and durability of the PCB in various operating conditions.
3. Electrical Performance: Consider the dielectric constant, dissipation factor, and electrical insulation properties of Shengyi S7045G to ensure that it meets the electrical performance requirements of the PCB design.
4. Chemical Resistance: Assess the material’s resistance to chemicals, moisture, and other environmental factors that may affect the PCB’s performance and longevity.
5. Manufacturing Process Compatibility: Ensure that the chosen high TG material is compatible with the manufacturing processes such as drilling, plating, and soldering used in PCB fabrication.
6. Cost and Availability: Consider the cost of Shengyi S7045G material and its availability in the desired form and thickness for the PCB manufacturing process.
7. Compliance and Certification: Verify that Shengyi S7045G material complies with industry standards and certifications required for the specific application, such as RoHS, UL, and IPC standards.
By carefully considering these factors, PCB designers and manufacturers can effectively leverage the benefits of Shengyi S7045G high TG PCB materials in their designs while ensuring the reliability and performance of the end product.
Applications of Shengyi S7045G PCB Substrates
Shengyi S7045G PCB substrates find applications in various electronic devices and systems that require high-performance and reliable circuitry. Some of the common applications include:
1.Servers:
Shengyi S7045G is suitable for server applications where high-speed and high-density circuitry is required. It can be used in server backplanes, line cards, and other components that handle data processing and communication in server systems.
2.Telecommunications and Base Stations:
The material is well-suited for telecommunications equipment and base station applications. It can be used in the construction of high-frequency circuit boards for devices such as routers, switches, and other network infrastructure components.
3. High-Performance Computing:
Shengyi S7045G is applicable in high-performance computing systems that demand reliable and efficient circuitry. It can be utilized in the construction of circuit boards for supercomputers, data centers, and other high-performance computing applications.
3.Office Routers:
The material can be employed in the manufacturing of circuit boards for office routers, providing reliable and high-speed connectivity for network devices in office environments.
4.Switches:
Shengyi S7045G can be used in the production of circuit boards for switches, enabling efficient data transmission and connectivity in various networking applications.
5.Computer Peripherals:
The material can be utilized in the production of circuit boards for computer peripherals such as printers, scanners, external storage devices, and other devices that require high-speed data transfer and reliable performance.
Overall, Shengyi S7045G PCB substrates are suitable for a range of applications in the fields of telecommunications, networking, computing, and other industries where high-performance and reliable circuitry are essential.
Conclusion
Shengyi S7045G high TG PCB materials provide circuit board engineers with an excellent choice for their design and manufacturing needs. With its high TG, this material ensures enhanced thermal stability, allowing for reliable operation under high-temperature conditions. Its excellent electrical properties, low insertion loss, and anti-CAF capability make it suitable for high-speed and high-frequency applications. Furthermore, the material’s compatibility with lead-free processes and its halogen-free composition align with environmental regulations. By leveraging the benefits of Shengyi S7045G, engineers can develop PCBs that deliver superior performance, reliability, and longevity in diverse industries.
