Different laminates are utilized in the manufacturing of electronic devices, each offering a distinct set of properties and performance characteristics. Among them, certain laminates stand out for their superior capabilities, making them highly sought-after for high-performance applications. Isola FR370HR is a prime example of such a laminate, renowned for its exceptional attributes. This article endeavors to elucidate the properties of Isola FR370HR, providing a comprehensive understanding of its significance.
What is Isola 370HR?
Isola 370HR is a high-performance laminate material used in the manufacturing of printed circuit boards (PCBs). It is a type of high-temperature, high-reliability material designed to meet the demanding requirements of various electronic applications.
Isola 370HR is classified as a glass-reinforced epoxy laminate, commonly known as FR-4 (Flame Retardant 4). FR-4 is the most widely used material for PCBs due to its excellent electrical properties, mechanical strength, and cost-effectiveness.
Copper Foil Types Used in Isola 370HR
The Isola 370HR PCB laminate utilizes different types of copper foils to cater to various application requirements. These copper foil types include:
1.Standard Electrodeposited (ED) Copper Foil:
This is the most commonly used copper foil type in the Isola 370HR laminate. It offers good electrical conductivity and is suitable for general-purpose applications.
2.Low Profile (LP) Copper Foil:
LP copper foil is designed to have a reduced surface roughness compared to standard copper foils. This helps to optimize signal integrity and reduce signal loss, making it ideal for high-frequency applications.
3.Reverse Treated (RT) Copper Foil:
RT copper foil is chemically treated to enhance its bond strength with the laminate resin. This improves the overall reliability and peel strength of the PCB. It is commonly used in applications where high mechanical strength is required.
4.Very Low Profile (VLP) Copper Foil:
VLP copper foil is characterized by its extremely smooth surface and low profile. It offers excellent signal integrity and is often used in high-speed and high-frequency applications where low insertion loss and controlled impedance are critical.
The choice of copper foil type for the Isola 370HR laminate depends on the specific design requirements and performance considerations of the PCB application. PCB manufacturers and designers can select the appropriate copper foil type to achieve the desired electrical, mechanical, and signal integrity characteristics for their PCB designs.
Performance Feature of Isola 370HR PCB Laminate
The Isola 370HR is a high Tg (glass transition temperature) PCB laminate that is specifically formulated for use in multilayer PCB applications. This laminate incorporates the renowned Fr-4 epoxy resin system, making it a reliable choice for a wide range of projects.
Low Dielectric Constant and Low Dissipation:
The material has a low dielectric constant and low dissipation factor, which means it provides good signal integrity and minimal signal loss. It also exhibits excellent dimensional stability, which is crucial for maintaining the integrity of PCBs during manufacturing processes such as drilling and plating.
Longevity and Reliability：
One of the standout features of the Isola 370HR PCB material is its exceptional resistance to CAF (Conductive Anodic Filament) formation. This ensures the longevity and reliability of the circuit board, even in demanding operating conditions. Additionally, the laminate includes UV blocking properties, safeguarding the board against potential damage caused by exposure to ultraviolet radiation.
Dielectric and Thermal Properties：
Notably, the Isola 370HR laminate offers outstanding dielectric and thermal properties, contributing to the overall performance and stability of the PCB. Its multifunctional epoxy resin, combined with E-glass fabric reinforcement, provides a unique blend of strength and thermal efficiency. This resin system not only enhances the thermal performance of the PCB but also maintains the processability associated with Fr-4 materials.
Mechanical and Thermal Performance：
One of the key strengths of Isola FR370HR lies in its ability to withstand elevated operating temperatures, typically ranging from 170 to 180 degrees Celsius. This characteristic renders it ideal for applications involving high-power components and devices that generate substantial heat. By effectively managing the thermal stress imposed on the laminate, Isola FR370HR ensures optimal performance and longevity in challenging operating conditions.
Furthermore, the Isola 370HR laminate surpasses traditional FR-4 materials in terms of mechanical and thermal performance. It is also compatible with Automated Optical Inspection (AOI) systems, facilitating efficient quality control processes. This makes it particularly well-suited for designs that require sequential lamination.
Thermal Analysis Techniques of Isola 370HR
Thermal analysis techniques are commonly used to study the thermal properties and behavior of materials like Isola 370HR. These techniques provide valuable information about the material’s response to temperature changes, thermal stability, and thermal conductivity. Here are some of the commonly employed thermal analysis techniques for studying Isola 370HR:
1.Differential Scanning Calorimetry (DSC):
DSC measures the heat flow into or out of a sample as a function of temperature. It can determine the glass transition temperature (Tg), melting point, and heat capacity of Isola 370HR. DSC can also detect any exothermic or endothermic reactions associated with the material.
2.Thermogravimetric Analysis (TGA):
TGA measures the weight change of a sample as a function of temperature. It helps determine the thermal stability and decomposition temperature of Isola 370HR. TGA can identify the onset of thermal degradation, volatilization of components, and estimate the material’s residual weight after heating.
3.Thermal Mechanical Analysis (TMA):
TMA measures dimensional changes in a sample as a function of temperature. It can determine the coefficient of thermal expansion (CTE) of Isola 370HR, which is crucial for designing PCBs that can withstand temperature variations without causing mechanical stress or failure.
4.Dynamic Mechanical Analysis (DMA):
DMA measures the mechanical properties of a material as a function of temperature, frequency, or time. It can determine the storage modulus, loss modulus, and damping behavior of Isola 370HR. DMA helps assess the material’s viscoelastic properties and its response to thermal stress.
5.Thermal Conductivity Measurement:
Thermal conductivity is an important property for materials used in electronic applications. Various techniques, such as laser flash analysis or guarded hot plate method, can be employed to measure the thermal conductivity of Isola 370HR. This information helps in designing PCBs that efficiently dissipate heat.
These thermal analysis techniques provide valuable insights into the behavior of Isola 370HR under different temperature conditions. They aid in material characterization, reliability assessment, and optimization of PCB designs for thermal management.
Isola 370HR Sequential Lamination
The process of sequential lamination involves the use of various technologies to laminate laminated subparts to an additional copper layer in the production of PCBs using Isola 370HR material. Isola 370HR typically undergoes at least two lamination cycles. Here are some technologies commonly employed for sequential lamination of this PCB material:
1. High layer count HDI: This technology involves the use of a thicker subpart consisting of approximately 6 to 26 layers. Additionally, there are two sequential circuitry layers on each side of the subpart. The center core of Isola 370HR utilizes buried vias.
2. Blind via boards: In this approach, the subparts are joined together, but they are positioned on the outer part of the finished PCB. Drilled plated through holes are used to create connections between the subparts and the finished PCB.
3. Standard HDI: The Isola 370HR material in this technology features a thin core at the center, consisting of approximately 2 to 4 layers. Each side of the core has 1 to 3 sequential applied circuitry layers. Microvias are used to link the external layers. Standard HDI is the most commonly used approach in Isola 370HR sequential lamination.
These technologies are utilized to ensure the successful production of PCBs with Isola 370HR material, providing enhanced functionality and reliability.
Isola 370HR PCB Laminate: Peel and Flexural Strength
When comparing the peel and flexural strength of Isola 370HR, it’s important to note that the specific values may vary depending on factors such as the thickness of the material, manufacturing process, and testing conditions.
1. Peel Strength: Peel strength refers to the ability of a laminate material, such as Isola 370HR, to resist delamination or separation between layers. It is typically measured by conducting a peel test, where a force is applied perpendicular to the plane of the material to separate the layers. The peel strength is reported in units of force per unit width (e.g., N/mm).
Isola 370HR is known to have good peel strength, which contributes to its overall reliability in multi-layer PCB applications. The specific peel strength values can vary depending on various factors, including the type of copper used, surface treatments, and the presence of any additional bonding agents or prepreg layers.
2. Flexural Strength: Flexural strength, also known as bending strength, measures the ability of a material to withstand bending or deformation under an applied load. It is determined by conducting a flexural test, where a sample of the material is subjected to a three-point or four-point bending setup. The flexural strength is typically reported in units of stress (e.g., MPa).
Isola 370HR exhibits good flexural strength, which is crucial for ensuring the structural integrity of PCBs during handling, assembly, and operation. The specific flexural strength values can depend on the thickness of the material and the manufacturing process used. Thicker laminates generally have higher flexural strength compared to thinner ones.
How to Create Holes in Isola 370HR?
The Isola 370HR material is highly regarded for its excellent thermal performance and impressive modulus properties, thanks to its advanced resin system.
One notable advantage of Isola PCBs over other FR406 materials is the minimal debris generated during the drilling process. Moreover, any drill debris that does occur tends to remain as lingering particles that have little impact on the drill volumes. This can be attributed to the thermal decomposition of the resin content in the material.
To effectively remove this resin debris, it is recommended to use top helix tools with angled drill patterns. When drilling smaller hole sizes, the use of backer and entry materials is advisable to prevent fracturing of the entire perimeter.
To avoid damaging the secondary drill hole perimeter, it is important to employ a sharper plunge focus. Additionally, thicker Isola 370HR boards with heavy copper or invar cladding require lighter drill options.
The quality of the drill boundaries is influenced by factors such as the condition of the drill tool, the drilling plan, and the fix quality. Finally, it is recommended to spin the drill tip at speeds of up to 170m/min, with a chip load ranging from 60 to 75 microns per revolution.
These considerations and techniques contribute to the successful drilling of Isola 370HR PCBs, ensuring optimal performance and reliability of the final product.
What is the Best Desmear Method for Isola 370HR?
The selection of the best desmear method for Isola 370HR laminate depends on various factors such as the specific application, equipment availability, and manufacturer’s recommendations. Desmear is the process of removing resin smears and other contaminants from the holes drilled in the PCB during manufacturing. Here are some commonly used desmear methods for Isola 370HR:
Chemical Desmear:
Chemical desmear involves using an etching solution to remove resin smears from the drilled holes. Typically, a mixture of strong oxidizing agents, such as permanganate or persulfate, is used to dissolve the resin. The choice of etchant and process parameters (concentration, temperature, and time) should be based on the manufacturer’s recommendations or industry best practices.
Plasma Desmear:
Plasma desmear involves exposing the PCB to a low-pressure plasma environment, where reactive gas species remove the resin smears. Plasma desmear offers controlled and precise removal of the resin without causing damage to the laminate. The choice of plasma chemistry and process parameters (gas composition, power, pressure, and duration) should be optimized for Isola 370HR to ensure effective desmear.
Mechanical Desmear:
Mechanical desmear involves physically scrubbing or brushing the drilled holes to remove the resin smears. This method is typically used in conjunction with chemical or plasma desmear to ensure complete removal of contaminants. Care should be taken to use appropriate brushes or scrubbing tools that do not damage the laminate surface.
Which industry Use for Isola 370HR PCB Laminate?
Isola 370HR PCB laminate finds application in various industries that require high-performance electronic devices. Some of the key industries where Isola 370HR is commonly used include:
●Telecommunications
●Consumer hardware.
●Aerospace and Defense.
●Processing, Storage gadgets, and Peripherals.
●Defense and aerospace applications.
●Automotive.
●Organizing and Communication Systems.
●Industrial Electronics.
●Transportation and automotive applications.
●Medical Devices.
●Clinical, Industrial, and Instrumentation.
These industries benefit from the exceptional properties of Isola 370HR, which include high-temperature stability, excellent electrical characteristics, dimensional stability, and overall durability. The laminate’s ability to meet the stringent demands of these sectors makes it a preferred choice for high-performance PCB applications.
Conclusion
Isola FR370HR stands out as a high-performance laminate, offering a multitude of advantageous properties for electronic device manufacturing. Its capacity to withstand high temperatures, exceptional electrical characteristics, and superior dimensional stability make it a preferred choice for demanding applications. By leveraging the remarkable capabilities of Isola FR370HR, manufacturers can enhance the reliability, performance, and longevity of electronic devices, meeting the evolving needs of modern technology.
If you require additional information or guidance on similar PCB materials, we are here to assist you. Our team is experienced in providing high-quality PCB products, including the Isola 370HR laminate. Feel free to reach out to us for any inquiries or assistance you may need in procuring top-notch PCB solutions.
