In the fast-paced world of electronic manufacturing, staying ahead of the competition requires utilizing cutting-edge materials that deliver exceptional performance and reliability. One such material that has gained recognition among electronic manufacturers is Arlon 84N PCB material. With its advanced properties and versatile applications, Arlon 84N has become a go-to choice for manufacturers seeking to optimize their electronic products. In this article, we will delve into the remarkable features and processing guidelines for Arlon 84N, enabling electronic manufacturers to unlock its full potential in their production processes.
What is Arlon 84N PCB Material?
Arlon 84N PCB Material is a high-performance material specifically designed for use in printed circuit boards (PCBs). It is a ceramic-filled polyimide prepreg that offers exceptional properties and benefits for PCB applications.
The material is derived from Arlon’s esteemed 85N pure polyimide system, which serves as the foundation for its outstanding performance. Arlon 84N is primarily utilized to fill etched areas within multilayer PCBs that contain thick copper layers. It is also highly suitable for filling clearance holes in metal cores.
One of the key advantages of Arlon 84N is its ability to minimize shrinkage, which is crucial during the through-hole drilling process. By incorporating a ceramic filler within the resin composition, the material effectively reduces the risk of cracking and enhances the overall reliability of the PCB.
Arlon 84N PCB Material meets the rigorous IPC-4101/40 and /41 requirements, ensuring its compliance with industry standards. It is a halogen-free material, making it environmentally friendly and aligning with sustainable practices.
The material offers exceptional thermal stability, making it well-suited for applications involving high temperatures. It is also compatible with lead-free soldering processes, further enhancing its versatility and usability.
Importantly, Arlon 84N PCB Material does not contain epoxy, which sets it apart from other materials in the market. This absence of epoxy contributes to its unique characteristics and makes it a reliable choice for demanding PCB applications.
Overall, Arlon 84N PCB Material is a high-performance solution that combines the benefits of ceramic-filled polyimide with Arlon’s expertise, meeting industry requirements and offering enhanced performance, reliability, and environmental sustainability for PCB manufacturing.
Features
Arlon 84N PCB Material boasts a range of impressive features that make it a top choice for demanding PCB applications:
●It meets the stringent IPC4101/40 and /41 description and specification, ensuring its compliance with industry standards.
●The material is composed of pure polyimide without any secondary resin, making it a reliable and consistent solution.
●Unlike many other materials, Arlon 84N does not contain any epoxy. It is free from epoxy additives, blends, or reactions, further enhancing its performance and reliability.
●It offers best-in-class thermal properties, with a glass transition temperature (Tg) of at least 250°C. This high Tg value indicates excellent heat resistance and dimensional stability.
●The decomposition temperature of Arlon 84N exceeds 407°C, surpassing the range of typical high-performance epoxies (300-360°C). This exceptional long-term high-temperature performance ensures reliability in demanding environments.
●The material exhibits low Z-axis expansion, with a rate of only 1.2% between 50-260°C. In comparison, typical high-performance epoxies have a range of 2.5-4.0%. This low expansion minimizes the risk of latent plated-through-hole (PTH) defects that can occur during solder reflow and device attachment processes.
●Arlon 84N features a toughened chemistry that resists resin fracturing, enhancing its durability and reliability in demanding applications.
●The material is halogen-free, aligning with environmental and safety standards. It does not contain halogen compounds, which are known to be harmful to the environment.
●Arlon 84N is compatible with lead-free processing techniques, allowing for seamless integration into modern manufacturing processes that prioritize lead-free soldering.
●It is compliant with RoHS (Restriction of Hazardous Substances) and WEEE (Waste Electrical and Electronic Equipment) directives, further emphasizing its commitment to environmental sustainability.
Properties of Arlon 84N PCB Substrates Material
Mechanical Properties:
●Peel Strength: The peel strength of Arlon 84N after thermal stress is 7.1 lb/in (1.2 N/mm). This value remains consistent even after process solutions and at increased temperatures, indicating the material’s durability and reliability.
●Water Absorption: Arlon 84N has a water absorption rate of 0.27%, indicating its low susceptibility to water absorption and moisture-related issues.
●Thermal Conductivity: The thermal conductivity of Arlon 84N is 0.25 W/mK, indicating its ability to efficiently dissipate heat.
Electrical Properties:
●Dielectric Constant: At 1 MHz, the dielectric constant of Arlon 84N is 4.2. At 1 GHz, this value decreases slightly to 4.0.
●Electrical Strength: The electrical strength of Arlon 84N is 1451 volts/mil (57.1 kV/mm), indicating its ability to withstand high electrical voltages without breakdown.
●Dissipation Factor: The dissipation factor of Arlon 84N at 1 MHz is 0.01, which is very low. This low dissipation factor indicates that Arlon 84N is an excellent insulator with minimal energy loss.
●Surface Resistivity: The surface resistivity of Arlon 84N is 1.6 x 10^8 ohms at C96/35/90 and remains the same at E24/125. This value indicates the material’s ability to resist the flow of electric current.
Thermal Properties:
●Glass Transition Temperature (Tg): Arlon 84N has a high Tg above 250 degrees Celsius, indicating its ability to maintain its mechanical and electrical properties at elevated temperatures.
●Decomposition Temperature: The decomposition temperature of Arlon 84N is 387 degrees Celsius. However, at 5% weight loss, the material’s thermal decomposition temperature (Td) is 407 degrees Celsius.
●Z-Axis CTE: The Z-axis coefficient of thermal expansion (CTE) of Arlon 84N is 48 ppm/°C before Tg. After Tg, this value increases to 150 ppm/°C. The Z-axis expansion between 50 to 260 degrees Celsius is 1.0%, indicating the material’s dimensional stability over a wide temperature range.
Overall, Arlon 84N PCB Substrates Material offers a combination of excellent thermal, mechanical, electrical, and environmental properties, making it a reliable and high-performance choice for a wide range of PCB applications.
Typical Applications
Arlon 84N PCB Substrates Material is well-suited for various applications that involve high temperatures and demanding environments. Some typical applications include:
1. PCBs Subjected to High Temperatures during Processing:
●Lead-Free Soldering: Arlon 84N is suitable for PCBs that undergo lead-free soldering processes, which involve higher temperatures compared to traditional soldering methods.
●HASL (Hot Air Solder Leveling): HASL is a common surface finish process that requires exposure to high temperatures. Arlon 84N can withstand the thermal stress associated with this process.
●IR Reflow: Arlon 84N can handle the elevated temperatures involved in infrared (IR) reflow soldering, which is a popular method for surface mount component assembly.
2. Applications with Long-Term Exposure to High Temperatures:
●Aircraft Engine Instrumentation: Arlon 84N can be used in PCBs for aircraft engine instrumentation systems, where components are exposed to high temperatures in the engine compartment.
●Down Hole Drilling: PCBs used in down hole drilling applications, where they are subjected to high temperatures and harsh conditions in oil and gas exploration, can benefit from the thermal stability of Arlon 84N.
●Under-Hood Automotive Controls: Arlon 84N is suitable for PCBs in automotive applications located in the engine compartment, where they are exposed to elevated temperatures and thermal cycling.
●Burn-In Boards: Burn-in boards used in the testing and screening of electronic components often require exposure to high temperatures. Arlon 84N can provide the necessary thermal stability for these applications.
●Industrial Sensors: Arlon 84N can be used in PCBs for industrial sensors that operate in high-temperature environments, ensuring reliable performance and longevity.
Recommended Process Conditions
Arlon 84N is highly recommended for applications involving etched areas in copper layers and clearance holes, as its high resin flow properties facilitate easy filling of these holes. The final pressed thickness of the material, comprising the glass and resin, will vary based on the density of holes to be filled.
To ensure optimal hole-filling performance, it is advised to use a minimum of two plies of Arlon 84N on each side of the material to be filled. Additional plies may be necessary for thicker systems. These plies should be accompanied by a single ply of standard 85N1080 or 106, which acts as a hydraulic medium to drive the filled resin into clear via holes.
When utilizing Arlon 84N as a prepreg with etched inner layers, the pressed thickness relies on the quantity and thickness of copper present on the inner layers. The Ho value represents the theoretical thickness that would exist without any flow or fill of inner layer copper.
Note: 84N0675HF grade features reduced resin content, resulting in a lower pressed thickness. However, for most applications, it is recommended to use the 84N0680HF grade as the lower resin grade may have limited effectiveness in hole fill for many applications.
It is crucial for customers to consider these recommendations and select the appropriate Arlon 84N grade based on their specific requirements to ensure optimal performance in hole filling and overall PCB applications.
Lamination Cycle:
Here are the recommended procedures for processing Arlon 84N PCB material:
1. Pre-vacuum: Prior to lamination, perform a pre-vacuum step for a duration of 30 to 45 minutes.
2. Heat Rise Control: Control the heat rise during lamination to a rate of 4.5°C to 6.5°C (8°F to 12°F) per minute between the temperature range of 100°C and 150°C (210°F and 300°F). Vacuum lamination is preferred. The recommended starting point vacuum lamination pressures are provided in the table below.
3. Cure Temperature and Time: Set the cure temperature at 218°C (425°F). Start the cure time when the product temperature exceeds 213°C (415°F). Maintain the temperature for 120 minutes.
4. Cooling: After the curing process, cool down the material under pressure at a rate of ≤ 5°C/min (10°F/min).
Additional recommendations for specific processes:
●Drilling: Drill at a speed of 350 SFM (Surface Feet per Minute). For vias measuring 0.018″ (0.45mm) or smaller, it is recommended to use undercut bits.
●De-smear: Use alkaline permanganate or plasma treatment with settings suitable for polyimide. Plasma treatment is preferred for positive etchback.
●Plating: Conventional plating processes are compatible with Arlon 84N.
●Profiling: Standard profiling parameters may be used. However, chip breaker style router bits are not recommended.
●Bake: Prior to soldering or reflow of HASL (Hot Air Solder Leveling), it is advisable to bake the material for 1 to 2 hours at 250°F (121°C).
Following these guidelines will help ensure proper processing and optimal performance of Arlon 84N PCB material.
Conclusion
Arlon 84N PCB material has revolutionized the landscape of PCB manufacturing, empowering material manufacturers to push the boundaries of performance and reliability. Its exceptional thermal stability, outstanding electrical properties, and enhanced resin flow create a foundation for high-quality circuit boards. By adhering to the recommended processing procedures, such as pre-vacuum treatment, controlled lamination with precise temperature and time parameters, optimal cooling under pressure, and meticulous drilling and plating techniques, PCB manufacturers can unlock the full potential of Arlon 84N.
With its compatibility with conventional plating processes, ease of profiling, and effective de-smear options, Arlon 84N streamlines the manufacturing process while delivering exceptional results. The recommended baking step prior to soldering or reflow ensures the material is primed for seamless integration into electronic assemblies.
Embrace the revolution of Arlon 84N PCB material and elevate your PCB manufacturing to new heights. Deliver products that surpass expectations, meet the demands of modern electronic applications, and cement your position as a leader in the industry.
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